Commercial Products
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Adhesive Film for Smart Card IC Package
Solution to Complete the Reliability of Smart Card Package
The adhesive material for smart cards is a key material that securely and firmly adheres IC chips embedded in various smart cards such as credit cards and passports. EPSOL maximizes the performance and durability of smart cards through technology that stably attach chips and card bodies.
Product Description
Adhesive materials consist of several layers, including release PET films, Thermoset adhesive films, and base films, and EPSOL’s adhesive materials are used in the processing IC chips into circuit boards and circuit components and finally attaching them to smart cards.
Application area
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Credit Crad
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ID Card
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Smart card etc.
Product Features
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Good adhesion
Secure the IC chip and substrate with a strong adhesion of more than 1 kg/cm to maintain stable performance.
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Excellent Temperature cycle
It maintains stable adhesion even in more than 200 temperature cycles, so there is no functional problem even in long-term use.
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Excellent heat resistance and moisture resistance
It ensures stable quality without deformation even in high temperatures above 95℃ and high humidity environments of 85℃ x 85% RH x 168hr.
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Good solvent resistance
It has passed various reliability tests and is strong in various external environments such as solvent resistance and water resistance.
SAW Filter PKG용 Molding film
Packaging material solution for ultra-small, ultra-high performance
The need to minimize the size of parts has increased as smartphones are becoming lighter, thinner, shorter and smaller. EPSOL’s molding film for SAW filters provides solutions optimized for the trend of miniaturization and low price of the latest low-power, multifunctional, integrated modules.
Background of development
The importance of high-performance materials for stable communication is growing as the expansion of 5G communication bandwidth increases the number of SAW filters used in smartphones from 5 to 7 to 10 to 12 compared to 4G communication. EPSOL has demonstrated its global market competitiveness by launching exports to three SAW filter manufacturers in China in 2021.
Application area
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Smart phone
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Communication device
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All electronic devices with SAW filters
Product Features
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Ultra-small packaging
EPSOL's molding film enables ultra-small CSP-type PKG to support miniaturization and modularization of parts.
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Reliable communication performance
High-performance materials ensure stable signal transmission in line with the increasing trend of 5G communication bandwidth.
Development Trend in SAW Filter Package
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Conventional Metal Lid PKG
In its most common form, it is large and takes up a lot of volume, with a size of 5-10mm.
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Metal cover PKG
It is 3 to 6mm smaller than the conventional form, contributing to the miniaturization of parts.
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CSP PKG
It is the smallest size at 1-2mm and is suitable for a highly integrated module to maximize the weight and miniaturization of parts.