Developed products
These are products that have been developed and commercialized over the past 20 years.
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These are products that have been developed and commercialized over the past 20 years.
These are key materials that are applied to all fields that require flexible circuit boards such as smartphones, wearable devices. EPSOL is leading the FPCB material market through its first development and mass production in Korea.
Adhesive sheet used to bond flexible substrates in multiple layers.
It is a key material used to manufacture flexible circuit boards of multilayer structure.
It is applied to certain parts of the flexible substrate that are firmly reinforced
Materials for high-performance, high-density circuit boards.
It is a material for circuit boards with a black appearance.
It is a product line developed to increase the efficiency and reliability of the semiconductor packaging process. EPSOL’s products contribute to the miniaturization, high integration, and high performance of semiconductor packages.
Adhesive film used to attach a chip to a lead frame
Adhesive film used for fixing fine leads within a high-density fine lead frame
Adhesive film that maintains a constant distance between chips within the muti-chip stack- package.
It is an adhesive material used to precisely cut semiconductor wafers using UV rays.
It is an adhesive material that prevents mold leakage in the QFN packaging process.
Adhesive film used for bonding between chips in multi chip stack-packages.
It absorbs electromagnetic interference (EMI) to increase the stability of the signal.
It shields electromagnetic waves to protect electronic components from external interference.
It is a functional film that improves the digitizer performance of the touch screen.
