EPSOL is building a systematic R&D roadmap based on the market size and the recent technological development trend. From the field you are currently focusing on to the next generation of technologies that will lead the future market, you can see EPSOL’s innovative technological development
EPSOL is leading the market by developing flexible, highly reliable advanced material technology in line with the trend of light, thin and multi-functionalization of FPCB.
Technology that enhances functions by stacking multiple layers of materials.
Technology to minimize the size and thickness of electronic devices.
Technology to improve performance by increasing the density of circuits.
Technology that integrates multiple functions of Rigid and Flexible into one part
Technology to save space by embedding electronic components inside the substrate.
Starting in 2014, we have been developing the core materials of the Flexible PCB. These technologies have already been applied to the market and are contributing to the miniatur-ization of electronic devices.
Adhesive sheet used to bond flexible substrates in multiple layers.
Material for circuits used to fabricate flexible circuit boards with a three-layer structure.
Material for circuits used to fabricate flexible circuit boards with a two-layer structure.
Insulating adhesive film that protects the circuit of the FPCB.
Adhesive material that firmly reinforces certain parts of the flexible substrate
Adhesive material with high electrical conductivity and increases the stability of the signal by preventing external electromagnetic interference.
Special Composite Function: Aimed to develop composite materials with enhanced specific functions, going beyond existing technologies.
Adhesive material that protects the internal circuit of electronic devices due to its strong moisture penetration resistance.
Material that effectively diffuses heat, it stabilizes the operating performance of electronic devices.
Low dielectric loss circuit material with excellent flexibility and heat resistance and can replace existing LCP materials
Transparent, Wearable Circuit : Researching future technologies, we have developed key materials for implementing transparent and wearable circuit.
Flexible circuit board material used in transparent wearable devices or displays.
Flexible circuit board material with stretchable properties.
Flexible circuit board used for tactile sensors based on electrical conductivity deviations.
