EPSOL is building a systematic R&D roadmap based on the market size and the recent technological development trend. From the field you are currently focusing on to the next generation of technologies that will lead the future market, you can see EPSOL’s innovative
EPSOL is leading the market by providing optimal solutions in line with the trend of high density, high integration, and miniaturization of semiconductor PKG.
Technology that enables high-density packaging by stacking multiple chips.
Ttechnology to minimize the size and thickness of electronic devices.
Material technology that increases power efficiency
Technology that improves data transmission speed by minimizing signal loss.
TSV technology enables wider bandwidth data transmission
Since 2014, we have been developing 2D PKG materials such as Lead On Chip / Lead Locking tape and Dicing Film.
Adhesive material used to attach semiconductor chips to substrates.
Adhesive film used to cut semiconductor wafers precisely.
Adhesive tape used to prevent mold leakage in the QFN type packaging process.
Adhesive film used to attach semiconductor chips directly to a substrate or to stack chips.
We have developed materials used in TSV technology for high density, high integration. We have gone beyond conventional technology and aimed to develop materials for high performance.
Adhesive material for temporarily bonding and debonding the device wafer in the TSV process.
Nonconductive adhesive film that fills the space between stacked chips in the TSV process.
Adhesive film applied in the grinding process to thin the thickness of semiconductor wafers.
Adhesive film to secure space between stacked chips in a stacked package
Adhesive material used for final package molding in the FO-WLP packaging process.
